JPH0432557U - - Google Patents

Info

Publication number
JPH0432557U
JPH0432557U JP7537590U JP7537590U JPH0432557U JP H0432557 U JPH0432557 U JP H0432557U JP 7537590 U JP7537590 U JP 7537590U JP 7537590 U JP7537590 U JP 7537590U JP H0432557 U JPH0432557 U JP H0432557U
Authority
JP
Japan
Prior art keywords
heat sink
metal plate
composite substrate
groove
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7537590U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7537590U priority Critical patent/JPH0432557U/ja
Publication of JPH0432557U publication Critical patent/JPH0432557U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
JP7537590U 1990-07-16 1990-07-16 Pending JPH0432557U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7537590U JPH0432557U (en]) 1990-07-16 1990-07-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7537590U JPH0432557U (en]) 1990-07-16 1990-07-16

Publications (1)

Publication Number Publication Date
JPH0432557U true JPH0432557U (en]) 1992-03-17

Family

ID=31615903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7537590U Pending JPH0432557U (en]) 1990-07-16 1990-07-16

Country Status (1)

Country Link
JP (1) JPH0432557U (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07162107A (ja) * 1993-12-08 1995-06-23 Nec Corp 低温対策用基板
JP2016096188A (ja) * 2014-11-12 2016-05-26 富士電機株式会社 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07162107A (ja) * 1993-12-08 1995-06-23 Nec Corp 低温対策用基板
JP2016096188A (ja) * 2014-11-12 2016-05-26 富士電機株式会社 半導体装置

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